Like most electronic products, intelligent robots also require heat dissipation to maintain stable operation. Their mainboard controller structure is equipped with heat sinks based on the location of heat sources, and thermal interface materials are used between them to conduct heat. Bourne recommends installing thermally conductive silicone sheets on the bottom of the PCB corresponding to the chips that require heat dissipation, as well as between the heat-generating chips and the heat sinks on the casing.

Today, with the rapid development of intelligent robots, they are gradually moving from laboratories and factories into various aspects of our lives—from dexterous collaborative robotic arms to service robots navigating between buildings, from smart home assistants to precision surgical platforms. Behind this high level of intelligence lies the efficient operation of increasingly powerful central processing units (CPUs) and graphics processing units (GPUs), artificial intelligence chips, and other integrated circuits.

However, the surge in computing power inevitably leads to heat accumulation. Heat dissipation has become a critical bottleneck restricting the performance, reliability, and lifespan of intelligent robots.

Within the thermal management system of robots, a seemingly minor yet crucial component exists: the interface between chip surfaces and heat sinks (such as vapor chambers or cooling fins) is never perfectly flush. At a microscopic level, numerous irregular gaps and grooves exist between the two contact surfaces. These voids are filled with air, which has extremely poor thermal conductivity, creating significant "thermal resistance" that severely impedes heat transfer from the chip to the heat sink. Thermal interface materials address this by filling these microscopic gaps, displacing the air, and minimizing thermal resistance to ensure efficient heat flow from the chip to the heat sink.

In intelligent robotics, which are complex systems integrating mechanics, electronics, software, and artificial intelligence, every detail impacts overall performance. As an indispensable component within thermal management systems, thermal interface materials may be small in size yet carry significant responsibility.

Borne Advanced Materials is dedicated to developing and manufacturing high-performance thermal interface materials. Through precise thermal management solutions, we effectively address critical heat dissipation challenges in intelligent robots, ensuring their core chips operate at full capacity within safe temperature ranges. This approach enhances overall system stability, extends service life, and unlocks greater performance potential.