Smartphones

Smartphone thermal design challenges:

-Increased power consumption of electronic components such as 5G chips, expanding heat dissipation needs

-OLED, foldable screen applications require appropriate thermal conductive materials to assist heat dissipation

-Wireless charging applications have appropriate thermal management

-Thinner and lighter mobile phone design, more concentrated internal structure, and heat dissipation difficulties.

Thermally conductive interface materials that can be applied to smartphones include:

① Thermally conductive gel (BN-TG350-60) can be used at the chip, the chip generates a large amount of heat, and the size of the mobile phone chip is small, with many precision micro-components inside. Thermally conductive gel presents a paste state, low compression stress, will not lead to deformation of mobile phone micro-components.

②Thermally conductive silicone grease (BN-GC5506 and BN-GC4021) can be applied directly or stencil/screen printed on the surface of mobile phone chips to fill in the gaps and reduce the temperature difference between the electronic devices to maintain the normal operation of the device. Thermally conductive silicone grease can fill the micro-gap, can be applied to the gap of 0.007 ~ 0.1mm.

③ Ultra-flexible thermally conductive spacer (BN-FS150US) can be directly attached to the CPU chip and heat sink or shell for heat transfer. With the characteristics of low hardness, high compression rate and low compression stress, the ultra-flexible thermal pads will not affect the chip and other precision components during assembly and will not damage the chip.

④ Carbon fibre thermally conductive spacer (BN-FS700-CF) can be attached between the package layer of CPU chip and metal plate to improve the heat dissipation efficiency; OLED materials are susceptible to high temperature and the need for heat dissipation increases, so it can be attached to the inside of OLED screen for heat dissipation. The directionality of the high thermal conductivity filler itself and the orientation arrangement in the matrix makes the carbon fibre thermally conductive spacer have low filling and high thermal conductivity, and excellent mechanical properties. Light weight, good resilience and low thermal resistance.